For fine and ultra-fine wire applications requiring an uncompromising surface finish, Coolervie’s precision-engineered single crystal diamond dies set the industry benchmark. By utilizing advanced laser-profiling and vacuum-sintering technology, Coolervie ensures each diamond is perfectly centered and oriented within the casing. This meticulous process guarantees exceptionally accurate hole sizing, superior wear resistance, and unmatched wire roundness. With Coolervie, you achieve peak production efficiency with minimum die pull and a virtually flawless wire surface every time.
PRODUCT SPECIFICATIONS
Hole Sizes
(0.025mm to 1.20mm)
Applications
Optimized for ultra-fine wire consistency. Coolervie ensures superior surface brilliance and stable production for your most demanding wire drawing operations
Typical Markets
Ideal for high-end electronics, medical devices, and precious metal processing where surface perfection is mandatory
ADVANTAGES
Superior Surface Integrity: Achieves the highest polish of any available die material.
Ultra-Low Friction: Minimizes die pull and extends machine maintenance cycles.
Optimized X-Ray Alignment: Ensures predictable wear patterns and maximum wire uniformity.
High Recut Recovery: Precision-mounted diamonds allow for multiple high-yield recuts.